Composite sintered body, semiconductor manufacturing apparatus member, and method of manufacturing composite sintered body

ABSTRACT

A method of manufacturing a composite sintered body includes a step (Step S11) of molding mixed powder in which Al2O3, SiC, and MgO are mixed, into a green body having a predetermined shape and a step (Step S12) of generating a composite sintered body by sintering the green body. Then, in Step S11, the ratio of SiC to the mixed powder is not lower than 4.0 weight percentage and not higher than 13.0 weight percentage. Further, the purity of Al2O3 in Step S11 is not lower than 99.9%. It is thereby possible to suppress the abnormal grain growth of Al2O3 and suitably manufacture a composite sintered body having high relative dielectric constant and withstand voltage, and low tan δ.

CROSS REFERENCE TO RELATED APPLICATION

The present application claims priority to International PatentApplication PCT/JP 2019/005853 filed on Feb. 18, 2019, the content ofwhich is incorporated herein by reference in its entirety.

TECHNICAL FIELD

The present invention relates to a composite sintered body, asemiconductor manufacturing apparatus member, and a method ofmanufacturing a composite sintered body.

BACKGROUND ART

In an apparatus of manufacturing a semiconductor substrate or the like,conventionally, used is a susceptor such as an electrostatic chuck whichholds a semiconductor substrate by adsorption using the Coulomb force orthe Johnsen-Rahbek force, a heater which increases the temperature of asemiconductor substrate, an electrostatic chuck heater combining theelectrostatic chuck and the heater, or the like. The electrostatic chuckincludes a main body having a substantially disk-like shape, on which asemiconductor substrate is placed, and an internal electrode buriedinside the main body. In the electrostatic chuck, by applying adirect-current voltage between the internal electrode and thesemiconductor substrate, a portion of the main body between the internalelectrode and the semiconductor substrate serves as a dielectric layer,and the semiconductor substrate is thereby adsorbed to the main body.

Patent Publication No. 6032022 (Document 1) and Patent Publication No.6103046 (Document 2) disclose a dielectric material for an electrostaticchuck, which is formed of a composite sintered body in which conductiveparticles each having a small particle diameter are dispersed in aninsulating material. As the insulating material, Al₂O₃ or the like isused, and as the conductive particles, SiC or the like is used. The SiCparticles used for manufacturing the dielectric material in Document 1includes SiC particles each having a particle diameter of 0.05 μm orsmaller in an amount from 50 weight percentage to 100 weight percentage.Further, the SiC particles used for manufacturing the dielectricmaterial in Document 2 includes SiC particles each having a particlediameter of 0.05 μm or smaller in an amount from 67 weight percentage to75 weight percentage.

On the other hand, Patent Publication No. 5501040 (Document 3) disclosesa technique for hot-press sintering of mixed powder of Al₂O₃ with MgF₂,as a method of manufacturing an alumina sintered body to be used for anelectrostatic chuck or the like.

Further, Japanese Patent Application Laid Open Gazette No. 2006-193353(Document 4) proposes an Al₂O₃ sintered body which contains SiCparticles having an average particle diameter from 0.5 μm to 2 μm in anamount of 5 to 35 weight percentage and contains Mg at 0.05 weightpercentage or lower in terms of oxide, as an Al₂O₃ sintered body usedfor a cutting tool.

Paragraph [0030] of Japanese Patent Application Laid Open Gazette No.2000-34174 (Document 5) proposes an Al₂O₃—SiC composite material inwhich MgO is added as a sintering aid. As described in claim 1,Paragraph [0011], and the like, oxide layers are provided on surfaces ofSiC particles and a liquid phase is formed by the reaction of the oxidelayer with Al₂O₃ particles, to thereby promote the sintering.

A semiconductor manufacturing apparatus member such as the electrostaticchuck or the like requires high corrosion resistance against ahalogen-based corrosive gas and plasma of the corrosive gas. In thedielectric material disclosed in Documents 1 and 2, however, since theparticle diameter of SiC having relatively low corrosion resistance issmall and the particle diameter of Al₂O₃ is also small, unevenness in asurface of the electrostatic chuck becomes prominent with corrosion andfall-off of SiC and this causes further fall-off of particles, andtherefore there is a possibility that the amount of corrosion per unittime may increase. Further, there is also a possibility that the Al₂O₃particles may be desorbed from the electrostatic chuck during adsorptionof the semiconductor substrate or the like, to thereby generateundesired particles.

Furthermore, in recent years, in the manufacture of a multilayer 3D NANDor the like, for high-aspect-ratio micromachining, used is a high-powerand high-speed etching apparatus. A material of an electrostatic chuckused in the etching apparatus requires low RF loss, high dielectricconstant, and less occurrence of dielectric breakdown. Further, in orderto suppress heat generation in application of RF, low tan δ (i.e.,dielectric loss tangent) is also required.

On the other hand, in the dielectric material disclosed in Document 2,tan δ at a frequency of 40 Hz is 0.018 to 0.042 and tan δ at a frequencyof 1 MHz is 0.0034 to 0.0062, and the withstand voltage of thedielectric material disclosed in Documents 1 and 2 is 16 kV/mm or lower.The tan δ of the material is not low, and there is a possibility ofgenerating heat due to the high-frequency (RF) environment. Further, thevalue of the withstand voltage is not sufficiently high, and when thedielectric material is used for the electrostatic chuck of theabove-described etching apparatus, there is a possibility of causingdielectric breakdown. Since the SiC particles are fine and highlydispersed in the dielectric material, the SiC particles are easy tobecome a conductive path, and it is difficult to increase the withstandvoltage. Furthermore, since the SiC particles are fine, it is estimatedthat the sinterability of the dielectric material is reduced, and it isthought that closed pores which are thereby generated also make itdifficult to reduce the tan δ and increase the withstand voltage. Inorder to suppress the heat generation of ceramics in the application ofRF, the tan δ is preferably not higher than 0.01, and more preferablynot higher than 0.005. Further, the withstand voltage is preferably notlower than 25 kV/mm, and more preferably not lower than 30 kV/mm.

Further, in Document 4, it is thought from descriptions in Paragraph[0019] and Table 1, or the like, that a commercially-available easilysinterable Al₂O₃ raw material in which MgO is added in advance is used.The easily sinterable alumina raw material contains a lot of impuritiessuch as sodium (Na) and the like (for example, several hundreds ppm ormore), and an amorphous phase is generated due to the impurities in agrain boundary of a sintered body. In the sintered body, Mg or the likewhich is added as a sintering aid is easy to be taken in the amorphousphase, and a compound derived from Mg or the like is amorphized, nothaving a crystal structure, in the grain boundary. This is obvious fromdescription in Paragraph [0010] of Document 4, that when the contentpercentage of Mg exceeds 0.05 weight percentage, a low-melting magnesiumcompound is formed in the grain boundary of Al₂O₃ or the like and thehigh temperature strength of the sintered body is reduced. Therefore,there is a limit to suppression of abnormal grain growth of Al₂O₃ (i.e.,suppression of coarsening of sintered particle diameter).

Similarly in Document 5, Mg or the like which is added as a sinteringaid is taken in the liquid phase (i.e., the amorphous phase) formed bythe reaction of the surface oxide layers of the SiC particles with Al₂O₃particles. For this reason, the compound derived from Mg or the like isamorphized, not having a crystal structure, in the grain boundary of thesintered body. Therefore, there is a limit to suppression of theabnormal grain growth of Al₂O₃.

SUMMARY OF INVENTION

The present invention is intended for a composite sintered body, and itis an object of the present invention to suppress the abnormal graingrowth of aluminum oxide and provide a composite sintered body havinghigh relative dielectric constant and withstand voltage, and low tan δ.

The composite sintered body according to one preferred embodiment of thepresent invention includes aluminum oxide, silicon carbide, andmagnesium-aluminum composite oxide having a spinel-type crystalstructure. The silicon carbide includes β-type silicon carbide. As tothe particle diameter of the silicon carbide, D50 is not smaller than0.7 μm. The ratio of carbon in the silicon carbide to the compositesintered body is not lower than 1.0 weight percentage and not higherthan 4.0 weight percentage. By the present invention, it is possible tosuppress the abnormal grain growth of aluminum oxide and provide acomposite sintered body having high relative dielectric constant andwithstand voltage, and low tan δ.

Preferably, the ratio of magnesium in the magnesium-aluminum compositeoxide to the composite sintered body is not lower than 0.01 weightpercentage and not higher than 1.0 weight percentage.

Preferably, the closed porosity of the composite sintered body is nothigher than 1.0%.

Preferably, as to the particle diameter of the silicon carbide, D10 isnot smaller than 0.3 μm.

Preferably, as to the particle diameter of the silicon carbide, D90 isnot smaller than 1.5 μm.

Preferably, the percentage of β-type silicon carbide contained in thesilicon carbide is higher than 50%.

Preferably, as to the sintered particle diameter of the aluminum oxide,the average particle diameter is not smaller than 2 μm.

Preferably, the withstand voltage of the composite sintered body is notlower than 25 kV/mm.

Preferably, the dielectric loss tangent of the composite sintered bodyat a frequency of 40 Hz and at a frequency of 1 MHz is not higher than1.0×10⁻².

Preferably, the relative dielectric constant of the composite sinteredbody at a frequency of 40 Hz and at a frequency of 1 MHz is not lowerthan 12.

Preferably, the volume resistivity of the composite sintered body at atemperature of 25° C. is not lower than 1.0×10¹⁵ Ω·cm.

Preferably, the four-point bending strength of the composite sinteredbody is not lower than 450 MPa.

Preferably, the open porosity of the composite sintered body is nothigher than 0.1%.

The present invention is also intended for a semiconductor manufacturingapparatus member. The semiconductor manufacturing apparatus memberaccording to one preferred embodiment of the present invention is formedby using the above-described composite sintered body. By the presentinvention, it is possible to suppress the abnormal grain growth ofaluminum oxide and provide a semiconductor manufacturing apparatusmember having high relative dielectric constant and withstand voltage,and low tan δ.

The present invention is still also intended for a method ofmanufacturing a composite sintered body. The method of manufacturing acomposite sintered body according to one preferred embodiment of thepresent invention includes a) molding mixed powder in which aluminumoxide, silicon carbide, and magnesium oxide are mixed, into a green bodyhaving a predetermined shape, and b) generating a composite sinteredbody by sintering the green body. The silicon carbide includes β-typesilicon carbide. In the operation a), the ratio of the silicon carbidein the mixed powder is not lower than 4.0 weight percentage and nothigher than 13.0 weight percentage. The purity of the aluminum oxide inthe operation a) is not lower than 99.9%. By the present invention, itis possible to suppress the abnormal grain growth of aluminum oxide andprovide a composite sintered body having high relative dielectricconstant and withstand voltage, and low tan δ.

Preferably, the ratio of the magnesium oxide in the mixed powder is notlower than 0.05 weight percentage and not higher than 1.0 weightpercentage in the operation a).

Preferably, as to the raw material particle diameter of the siliconcarbide in the operation a), D10 is not smaller than 0.3 μm, D50 is notsmaller than 1 μm, and D90 is not smaller than 2 μm.

Preferably, as to the sintered particle diameter of the aluminum oxideafter the operation b), the average particle diameter is not smallerthan 2 μm.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a cross section showing an electrostatic chuck;

FIG. 2 is a flowchart showing an operation flow for manufacturing achuck body;

FIG. 3 is a SEM image of a polished surface of a composite sinteredbody;

FIG. 4 is a SEM image of a polished surface of another compositesintered body;

FIG. 5 is a view showing an X-ray diffraction pattern of the compositesintered body;

FIG. 6 is an enlarged view showing the X-ray diffraction pattern of thecomposite sintered body;

FIG. 7 is a view showing elemental mapping images of the compositesintered body;

FIG. 8 is a view showing a result of performing an elemental mapping onthe composite sintered body;

FIG. 9 is a view showing a result of performing an elemental mapping onthe composite sintered body; and

FIG. 10 is a view showing a result of performing an elemental mapping onthe composite sintered body.

DESCRIPTION OF EMBODIMENTS

FIG. 1 is a cross section showing an electrostatic chuck 1 in accordancewith one preferred embodiment of the present invention. Theelectrostatic chuck 1 is a semiconductor manufacturing apparatus memberused in a semiconductor manufacturing apparatus. The electrostatic chuck1 holds a substantially disk-like semiconductor substrate (hereinafter,referred to simply as a “substrate 9”) by electrostatically adsorptionusing the Coulomb force or the Johnsen-Rahbek force.

The electrostatic chuck 1 includes a chuck part 21 and a base part 22.The chuck part 21 is a member having a substantially disk-like shape.The chuck part 21 is attached on the base part 22. The chuck part 21includes a chuck body 23 and an internal electrode 24. The chuck body 23is a member which has a substantially disk-like shape and is formed of acomposite sintered body. On an upper surface of the chuck body 23,placed is a substrate 9. The internal electrode 24 is an electrodedisposed inside the chuck body 23. In the electrostatic chuck 1, byapplying a direct-current voltage between the internal electrode 24 andthe substrate 9, a portion of the chuck body 23 between the internalelectrode 24 and the substrate 9 serves as a dielectric layer, and thesubstrate 9 is thereby electrostatically adsorbed to the upper surfaceof the chuck body 23. Though not shown, inside the chuck body 23 on theside of the base part 22, a heater electrode may be provided.

The chuck body 23 is a composite sintered body including Al₂O₃ (aluminumoxide), SiC (silicon carbide), and a Mg—Al composite oxide(magnesium-aluminum composite oxide) having a spinel-type crystalstructure. In the following description, the above-described Mg—Alcomposite oxide having a spinel-type crystal structure will be alsoreferred to simply as a “Mg—Al composite oxide”. The ratio of C (carbon)to the whole composite sintered body (i.e., the ratio of C in SiC to thecomposite sintered body) is not lower than 1.0 weight percentage and nothigher than 4.0 weight percentage. Preferably, the ratio of C in thecomposite sintered body is not lower than 1.1 weight percentage and nothigher than 3.8 weight percentage. The ratio of Mg in the Mg—Alcomposite oxide (i.e., the ratio of Mg contained in the Mg—Al compositeoxide) to the whole composite sintered body is preferably not lower than0.01 weight percentage and not higher than 1.0 weight percentage. Morepreferably, the ratio of Mg in the composite sintered body is not lowerthan 0.01 weight percentage and not higher than 0.7 weight percentage.In the chuck body 23, SiC particles are dispersed inside the Al₂O₃particles, a grain boundary, and a grain boundary triple point, andparticles of Mg—Al composite oxide exist in a form of particles andscattered in the composite sintered body.

As to the particle diameter (i.e., the diameter of a particle) of theSiC particles dispersed in the composite sintered body, D10 ispreferably not smaller than 0.3 μm. Further, D50 is preferably notsmaller than 0.7 μm. D90 is preferably not smaller than 1.5 μm. D10,D50, and D90 are particle diameters in the cases where the cumulativevolume percentage of the SiC particles in a volume particle sizedistribution is 10 volume percentage, 50 volume percentage, and 90volume percentage, respectively. As to the sintered particle diameter ofAl₂O₃ in the chuck body 23, the average particle diameter is preferablynot smaller than 2μm. The closed porosity of the chuck body 23 ispreferably not higher than 1.0%.

The withstand voltage of the chuck body 23 is preferably not lower than25 kV/mm. The tan δ (i.e., the dielectric loss tangent) of the chuckbody 23 at a frequency of 40 Hz and at a frequency of 1 MHz ispreferably not higher than 1.0×10⁻². More preferably, the tan δ in arange of frequency not lower than 40 Hz and not higher than 1 MHz is nothigher than 1.0×10⁻². The relative dielectric constant of the chuck body23 at a frequency of 40 Hz and at a frequency of 1 MHz is preferably notlower than 12. More preferably, the relative dielectric constant in arange of frequency not lower than 40 Hz and not higher than 1 MHz is notlower than 12. The volume resistivity of the chuck body 23 at atemperature of 25° C. is preferably not lower than 1.0×10¹⁵ Ω·cm. Thefour-point bending strength of the chuck body 23 is preferably not lowerthan 450 MPa.

Next, with reference to FIG. 2, a method of manufacturing the chuck body23 will be described. In the manufacture of the chuck body 23, first,mixed powder in which Al₂O₃, SiC, and MgO (magnesium oxide) are mixed ismolded into a green body having a predetermined shape (Step S11).

For example, in Step S11, first, respective powders of Al₂O₃, SiC, andMgO are wet-mixed in an organic solvent, to thereby become a slurry.Subsequently, the slurry is dried to become mixed powder (i.e., preparedpowder), and the mixed powder is molded into the above-described greenbody. The solvent for the above-described wet mixing may be, forexample, ion exchange water. Further, the respective powders of Al₂O₃,SiC, and MgO may be dry-mixed, instead of being wet-mixed.

The mixed powder is filled into, for example, a hot press die, to bethereby formed into a green body having a predetermined shape. When thegreen body has a plate-like shape, the mixed powder may be filled into adie for uniaxial pressing, or the like, to be thereby molded. Formationof the green body may be performed by any one of various other methodsonly if the shape can be maintained. Further, like the above-describedslurry, the mixed powder may be formed into a green body having apredetermined shape by inpouring the mixed powder in a fluid state intoa mold and then removing the solvent component.

In Step S11, the ratio of SiC in the above-described mixed powder is notlower than 4.0 weight percentage and not higher than 13.0 weightpercentage. Preferably, the ratio of SiC in the mixed powder in Step S11is not lower than 4.0 weight percentage and not higher than 10.0 weightpercentage. Further, the ratio of MgO in the mixed powder is preferablynot lower than 0.025 weight percentage and not higher than 1.0 weightpercentage, and more preferably not lower than 0.05 weight percentageand not higher than 0.3 weight percentage. The purity of Al₂O₃, SiC, andMgO is preferably not lower than 99%, and more preferably not lower than99.9%.

The SiC used in Step S11 is preferably β-SiC (i.e., SiC having a β-typecrystal). It is thereby possible to reduce tan δ as compared with thecase where α-SiC (i.e., SiC having an α-type crystal) is used. As to theparticle diameter (i.e., the raw material particle diameter) of SiC inStep S11, preferably, D10 is not smaller than 0.3 μm, D50 is not smallerthan 1 μm, and D90 is not smaller than 2 μm. Further, the raw materialparticle diameter herein is a result of measurement by using a particlesize distribution measuring device based on laser diffractometry. When asintered body is obtained through a process of mixture or milling, bysetting the particle diameter of SiC raw material in the above-describedrange, it becomes easier to achieve a particle diameter not smaller than0.3 μm as D10, a particle diameter not smaller than 0.7 μm as D50, and aparticle diameter not smaller than 1.5 μm as D90, as the particlediameter (observed by the SEM (Scanning Electron Microscope) method) ofthe SiC particles dispersed in the Al₂O₃. As a result of measurement ofa particle size distribution of the SiC raw material by laserdiffractometry, D10 is 0.8 μm, D50 is 2.5 μm, and D90 is 5.7 μm.

After the green body is obtained in Step S11, sintering of the greenbody is performed and the chuck body 23 which is a composite sinteredbody is thereby generated (Step S12). In a case of using the hot-pressmethod, the green body is arranged in the hot press die and then heatedand pressurized, and the composite sintered body is thereby obtained. Inthe hot-press method, sintering of the green body is performed, forexample, under vacuum atmosphere or non-oxidizing atmosphere. Theheating temperature, the press pressure, and the sintering time at thehot press may be determined as appropriate. The maximum heatingtemperature at the hot press is preferably not lower than 1650° C. andnot higher than 1725° C. By setting the maximum temperature in theabove-described range, it is possible to avoid remarkable change of theparticle size distribution due to sintering of SiC particles orpossibility of transforming β-SiC into α-SiC.

The internal electrode 24 may be generated inside the chuck body 23 byburying an electrode material inside the above-described green bodyconcurrently with Step S11 and sintering the electrode material togetherwith the green body in Step S12. Alternatively, by putting the internalelectrode 24 between the two composite sintered bodies generated inSteps S11 to S12, the internal electrode 24 may be arranged inside thechuck body 23 formed of the two composite sintered bodies. Generationand arrangement of the internal electrode 24 may be performed by any oneof various methods.

Next, with reference to Tables 1 to 6, Experimental Examples 1 to 13 ofthe composite sintered body in accordance with the present invention andcomposite sintered bodies of Comparative Examples 1 to 5 to be comparedwith the composite sintered body of the present invention will bedescribed. As shown in Table 1, among Experimental Examples 1 to 13, atleast one of the composition ratio and the maximum sintering temperatureof Al₂O₃, SiC, and MgO which are raw materials is different. InExperimental Examples 1 to 13, the ratio of SiC to the mixed powder ofAl₂O₃, SiC, and MgO is not lower than 4.0 weight percentage and nothigher than 13.0 weight percentage. In Experimental Examples 1 to 13, asthe raw material SiC, β-SiC powder is used. Further, in ExperimentalExamples 1 to 13, the ratio of MgO to the mixed powder is not lower than0.05 weight percentage and not higher than 1.0 weight percentage.

In Comparative Example 1, the raw material includes only Al₂O₃ and doesnot include SiC or MgO. In Comparative Example 2, the raw materialincludes Al₂O₃ and SiC and does not include MgO. In Comparative Example3, Al₂O₃ powder having low purity (lower than 99%) is used as the rawmaterial. In Comparative Example 4, SiC powder having a small averageparticle diameter of 0.3 μm (having a purity of 99% or higher) is usedas the raw material. Further, the raw material SiC in ComparativeExample 4 includes α-SiC powder and β-SiC powder. In Comparative Example5, as raw material SiC, α-SiC powder is used. In Comparative Example 5,the α-SiC powder having a purity of 98% or higher and an averageparticle diameter of 2.9 μm is used as the raw material.

<Raw Material Powder>

In Experimental Examples 1 to 13, as Al₂O₃, used is high purity Al₂O₃powder having a purity of 99.99% or higher and an average particlediameter of 0.4 to 0.6 μm. As to the content percentage of impurities inthe high purity Al₂O₃ powder, the content percentage of Si is 40 ppm orlower, those of Mg, Na, and copper (Cu) are each 10 ppm or lower, andthat of iron (Fe) is 20 ppm or lower. In Experimental Examples 1 to 13,as SiC, used is β-SiC powder having a purity of 99.9% or higher and anaverage particle diameter of 2.5 μm. As to the content percentage ofimpurities in the β-SiC powder, the content percentage of Al is 100 ppmor lower and those of Mg and Na are each 50 ppm or lower. As MgO, usedis high purity MgO powder having a purity of 99.9% or higher and anaverage particle diameter of 1 μm or smaller. As to the contentpercentage of impurities in the MgO powder, the content percentage of Alis 10 ppm or lower and that of Si is 10 ppm or lower. Also inComparative Examples 1 to 5, details of the raw material powders are thesame as those in Experimental Examples when there is no particulardescription thereof in the previous paragraph.

<Mixed Powder>

The above-described raw material powder is weighed to have an amount(weight percentage) shown in Table 1 and wet-mixed for four hours byusing a nylon pot and isopropyl alcohol (IPA) as a solvent. For the wetmixing, an alumina pebble having a diameter (φ) of 3 mm is used inExperimental Examples 1 to 4, Experimental Examples 7 to 9, andComparative Examples 1 to 5, and an iron-core nylon ball having adiameter (φ) of 20 mm is used in Experimental Examples 5 to 6 andExperimental Examples 10 to 13. The pebble used in mixing is notparticularly limited, but in a case where a pebble having high specificgravity and high grinding efficiency is used, for example, caution isrequired since milling of the raw material powder (herein, the SiCparticles) is promoted and the particle diameter after the wet mixingsometimes becomes smaller than the raw material particle diameter. Inorder to keep the particle diameter of the SiC particles dispersed inAl₂O₃ within the above-described preferable range, it is preferable thatthe wet mixing time should be adjusted as appropriate between four andtwenty hours. The slurry after mixing is taken out and dried at 110° C.in the nitrogen stream. After that, the dried powder is sieved by a30-mesh sieve, to thereby obtain mixed powder. The solvent for the wetmixing may be, for example, ion exchange water. Further, there may be acase where the slurry is dried by using a rotary evaporator and thensieved by a 100-mesh sieve, to thereby obtain mixed powder.Alternatively, granulated powder may be obtained by using a spray dryeror the like. Further, as necessary, a heat treatment is performed on themixed powder at 450° C. for five hours or more under the atmosphere, tothereby remove a carbon component contaminated during the wet mixing.

<Molding>

Uniaxial pressing of the above-described mixed powder is performed witha pressure of 100 kgf/cm², to thereby form a disk-like green body havinga diameter (φ) of 50 mm and a thickness of about 20 mm, and the greenbody is accommodated in a sintering graphite mold. The molding pressureis not particularly limited but may be variously changed only if theshape can be maintained. The mixed powder may be filled into thehot-press die in a state of unmolded powder.

<Sintering>

The above-described green body is sintered by the hot-press method undervacuum atmosphere. The press pressure is 250 kgf/cm². The maximumtemperature at heating is from 1650° C. to 1725° C., and the holdingtime at the maximum temperature is four to eight hours.

TABLE 1 Raw Material SiC Al₂O₃ Average Maximum High Crys- ParticleTemper- Pu- tal Diameter MgO ature wt % rity wt % Type (μm) wt % ° C.Experimental 91.7 ◯ 8.2 β 2.5 0.1 1700 Example 1 Experimental 93.3 ◯ 6.6β 2.5 0.1 1700 Example 2 Experimental 95.2 ◯ 4.7 β 2.5 0.1 1700 Example3 Experimental 90.0 ◯ 9.9 β 2.5 0.1 1700 Example 4 Experimental 93.4 ◯6.6 β 2.5 0.05 1700 Example 5 Experimental 94.6 ◯ 5.3 β 2.5 0.05 1700Example 6 Experimental 87.4 ◯ 12.5 β 2.5 0.1 1700 Example 7 Experimental93.0 ◯ 6.5 β 2.5 0.5 1700 Example 8 Experimental 93.3 ◯ 6.6 β 2.5 0.11650 Example 9 Experimental 93.3 ◯ 6.6 β 2.5 0.1 1725 Example 10Experimental 93.2 ◯ 6.5 β 2.5 0.3 1700 Example 11 Experimental 95.0 ◯4.0 β 2.5 1.0 1650 Example 12 Experimental 95.0 ◯ 4.1 β 2.5 0.075 1750Example 13 Comparative 100.0 ◯ 0.0 — — — 1700 Example 1 Comparative 91.8◯ 8.2 β 2.5 — 1700 Example 2 Comparative 90.0 — 9.9 β 2.5 0.1 1650Example 3 Comparative 90.0 ◯ 9.9 α, β 0.3 0.1 1650 Example 4 Comparative90.0 ◯ 9.9 α 2.9 0.1 1650 Example 5

TABLE 2 Open Bulk Relative Closed Porosity Density Density Porosity %g/cm³ % % Experimental 0.02 3.89 99.6 0.4 Example 1 Experimental 0.023.92 99.7 0.3 Example 2 Experimental 0.02 3.93 99.6 0.4 Example 3Experimental 0.01 3.88 99.5 0.5 Example 4 Experimental 0.01 3.91 99.50.5 Example 5 Experimental 0.02 3.92 99.6 0.2 Example 6 Experimental0.01 3.87 99.7 0.2 Example 7 Experimental 0.01 3.92 99.7 0.3 Example 8Experimental 0.01 3.91 99.6 0.4 Example 9 Experimental 0.01 3.92 99.70.3 Example 10 Experimental 0.01 3.91 99.7 0.4 Example 11 Experimental0.00 3.93 99.6 0.4 Example 12 Experimental 0.01 3.93 99.7 0.2 Example 13Comparative 0.07 3.97 99.6 0.4 Example 1 Comparative 0.07 3.87 98.9 1.1Example 2 Comparative 0.15 3.87 98.9 1.0 Example 3 Comparative 0.11 3.8899.3 1.2 Example 4 Comparative 0.04 3.89 99.5 0.8 Example 5

TABLE 3 Relative Dielectric Volume Withstand Strength ConstantResistivity Voltage MPa @300 KHz Ω · cm kV/mm Experimental 783 163.4E+16 50 Example 1 Experimental 554 14 1.0E+17 66 Example 2Experimental 715 13 1.1E+17 110 Example 3 Experimental 686 19 3.7E+16 32Example 4 Experimental 574 14 5.1E+16 64 Example 5 Experimental 582 148.2E+16 85 Example 6 Experimental 623 20 8.1E+16 28 Example 7Experimental 677 13 6.3E+16 65 Example 8 Experimental 530 13 8.8E+16 63Example 9 Experimental 559 14 5.5E+16 65 Example 10 Experimental 594 149.1E+16 78 Example 11 Experimental 557 12 1.0E+17 117 Example 12Experimental 566 13 8.8E+16 100 Example 13 Comparative 279 10 4.8E+16 41Example 1 Comparative 433 16 5.2E+16 51 Example 2 Comparative 298 192.3E+16 29 Example 3 Comparative 489 18 2.7E+16 26 Example 4 Comparative591 18 5.5E+16 32 Example 5

TABLE 4 tan δ tan δ tan δ @40 Hz @300 KHz @1 MHz Experimental <1.0E−032.5E−03 4.2E−03 Example 1 Experimental <1.0E−03 1.0E−03 1.5E−03 Example2 Experimental <1.0E−03 <1.0E−03  <1.0E−03  Example 3 Experimental 1.5E−03 3.5E−03 8.4E−03 Example 4 Experimental <1.0E−03 1.2E−03 1.6E−03Example 5 Experimental <1.0E−03 <1.0E−03  1.1E−03 Example 6 Experimental<1.0E−03 4.5E−03 7.3E−03 Example 7 Experimental <1.0E−03 1.8E−03 3.9E−03Example 8 Experimental <1.0E−03 <1.0E−03  1.5E−03 Example 9 Experimental<1.0E−03 1.8E−03 3.0E−03 Example 10 Experimental <1.0E−03 2.4E−033.9E−03 Example 11 Experimental <1.0E−03 <1.0E−03  <1.0E−03  Example 12Experimental <1.0E−03 <1.0E−03  <1.0E−03  Example 13 Comparative<1.0E−03 <1.0E−03  <1.0E−03  Example 1 Comparative <1.0E−03 1.6E−032.5E−03 Example 2 Comparative <1.0E−03 3.1E−03 6.8E−03 Example 3Comparative <1.0E−03 2.9E−03 2.5E−03 Example 4 Comparative <1.0E−032.3E−03 2.4E−03 Example 5

TABLE 5 Al₂O₃ Average Particle SiC Particle Diameter Particle DiameterD10 D50 D90 Diameter Ratio μm μm μm μm L1/L2 Experimental 0.5 0.9 1.72.9 4.1 Example 1 Experimental 0.7 1.1 2.1 2.6 3.7 Example 2Experimental 0.5 1.0 1.7 3.5 2.4 Example 3 Experimental 0.5 1.0 2.1 3.03.0 Example 4 Experimental 0.7 1.4 2.6 2.4 7.3 Example 5 Experimental0.9 1.8 3.1 3.0 7.4 Example 6 Experimental 0.6 0.9 1.5 2.8 4.0 Example 7Experimental 0.3 0.7 1.6 2.7 7.7 Example 8 Experimental 0.6 1.3 2.2 3.03.1 Example 9 Experimental 0.6 0.9 1.7 4.1 2.3 Example 10 Experimental0.6 1.0 1.5 4.6 2.8 Example 11 Experimental 0.5 1.3 1.7 4.6 2.7 Example12 Experimental 0.7 1.2 2.6 2.5 2.5 Example 13 Comparative — — — 17.52.9 Example 1 Comparative 0.7 1.0 2.0 93.3 3.1 Example 2 Comparative 0.51.1 2.4 8.7 3.5 Example 3 Comparative 0.1 0.3 0.9 1.4 2.9 Example 4Comparative 0.8 1.8 3.5 4.1 2.4 Example 5

TABLE 6 Amount Amount of C in of Mg in Crystal Sintered Sintered PhaseBody Body Identified wt % wt % by XRD Experimental 2.48 0.06 Al₂O₃,SiC(β), MgAl₂O₄ Example 1 Experimental 1.97 0.05 Al₂O₃, SiC(β), MgAl₂O₄Example 2 Experimental 1.41 0.05 Al₂O₃, SiC(β), MgAl₂O₄ Example 3Experimental 2.97 0.06 Al₂O₃, SiC(β), MgAl₂O₄ Example 4 Experimental2.02 0.02 Al₂O₃, SiC(β), MgAl₂O₄ Example 5 Experimental 1.52 0.03 Al₂O₃,SiC(β), MgAl₂O₄ Example 6 Experimental 3.71 0.07 Al₂O₃, SiC(β), MgAl₂O₄Example 7 Experimental 1.93 0.29 Al₂O₃, SiC(β), MgAl₂O₄ Example 8Experimental 1.99 0.04 Al₂O₃, SiC(β), MgAl₂O₄ Example 9 Experimental1.97 0.05 Al₂O₃, SiC(β), MgAl₂O₄ Example 10 Experimental 1.96 0.17Al₂O₃, SiC(β), MgAl₂O₄ Example 11 Experimental 1.18 0.57 Al₂O₃, SiC(β),MgAl₂O₄ Example 12 Experimental 1.20 0.03 Al₂O₃, SiC(β), MgAl₂O₄ Example13 Comparative 0.01 — Al₂O₃ Example 1 Comparative 2.48 — Al₂O₃, SiC(β)Example 2 Comparative 2.95 0.05 Al₂O₃, SiC(β) Example 3 Comparative 2.930.06 Al₂O₃, SiC(β), SiC(α), MgAl₂O₄ Example 4 Comparative 2.93 0.07Al₂O₃, SiC(α), MgAl₂O₄ Example 5

<Evaluation>

The composite sintered body obtained by the above-described sintering isprocessed for each type of evaluation, and evaluations shown in Tables 2to 6 are performed.

The open porosity, the bulk density, and the apparent density aremeasured by the Archimedes' method using pure water as a medium. For themeasurement, a flexural bar having a size of 3mm×4 mm×40 mm is used, andthe surface is finished with #800. The theoretical density is calculatedon the basis of the theoretical density of each raw material and theamount (weight percentage) of usage of each raw material, assuming thatall the raw materials (Al₂O₃, SiC, and MgO) which are mixed in themanufacture of the composite sintered body remain in the compositesintered body without any change. The theoretical density of Al₂O₃ whichis used for the calculation is 3.99 g/cm³, that of SiC is 3.22 g/cm³,and that of MgO is 3.60 g/cm³. The relative density is calculated bydividing the bulk density by the theoretical density and thenmultiplying the quotient by 100. Assuming that the above-describedtheoretical density is equal to the true density, the closed porosity iscalculated by subtracting the quotient obtained by dividing the apparentdensity by the true density from 1 and then multiplying the differenceby 100.

The four-point bending strength is calculated by performing a four-pointbending test in conformity with “JIS R1601”. The relative dielectricconstant and tan δ is measured by the method in conformity with “JISC2141” using a specimen having a thickness of 2 mm at room temperaturein the atmosphere.

The volume resistivity is measured by the method in conformity with “JISC2141” at room temperature under vacuum atmosphere. The specimenconfiguration is φ50 mm×1 mm. The diameter of a main electrode is 20 mm.The inner diameter and the outer diameter of a guard electrode are 30 mmand 40 mm, respectively. The diameter of an application electrode is 45mm. The main electrode, the guard electrode, and the applicationelectrode are formed of Ag (silver). The applied voltage is 500 V/mm. Acurrent value after one minute has elapsed from voltage application isread and the volume resistivity is calculated from the current value.

The withstand voltage is an instantaneous withstand voltage measured bya method in conformity with “JIS C2141” using a specimen having athickness of 0.2 mm, by applying a direct-current voltage at roomtemperature in the atmosphere.

The particle diameter of SiC is obtained by the SEM observation method.Specifically, in a SEM image obtained by observing a polished surface ofthe composite sintered body with a magnification of 3000 times or more,the long diameter of SiC particle is measured as a particle diameter,and the respective particle diameters of particles corresponding to 10%,50%, and 90% from one having the smallest particle diameter among allthe measurement results (60 pieces or more) are D10, D50, and D90,respectively. FIGS. 3 and 4 are respective SEM images of the polishedsurfaces of the composite sintered bodies in Experimental Examples 1 and2.

The particle diameter of Al₂O₃ is measured by the intercept method.Specifically, any number of line segments are drawn in a SEM imageobtained by observing the polished surface of the composite sinteredbody, and the number n of crystal particles crossing the line segmenthaving a length L is obtained. Further, when an end of the line segmentis located inside the crystal particle, the crystal particle is countedas ½. Assuming that a value obtained by dividing the length L of theline segment by n is an average particle size (i.e., average segmentlength) of 1, a value obtained by multiplying the average particle sizeof 1 by a coefficient of 1.5 is the average particle diameter.

The particle diameter ratio L1/L2 of Al₂O₃ is obtained by dividing themaximum length L1 of the line segment on one Al₂O₃ particle by theminimum length L2 of the line segment on one Al₂O₃ particle in anynumber of line segments on the above-described SEM image. The particlediameter ratio L1/L2 of Al₂O₃ becomes closer to 1 as the uniformity ofdistribution of the crystal particle diameter of Al₂O₃ becomes higherand becomes farther from 1 and a larger value as the uniformity becomeslower. As shown in FIG. 5, as the content percentage of MgO which is araw material becomes lower, the particle diameter ratio L1/L2 of Al₂O₃tends to become larger. When the particle diameter ratio L1/L2 of Al₂O₃approximates to 1, the inplane uniformity of corrosion is increased inthe chuck body 23 of the electrostatic chuck 1, and as a result,undesirable dust generation is suppressed. In terms of increasing theuniformity of distribution of the crystal particle diameter of Al₂O₃ ,the particle diameter ratio L1/L2 of Al₂O₃ is preferably not more than8, and more preferably not more than 5. Therefore, the ratio of Mg inthe Mg—Al composite oxide to the composite sintered body is preferablynot lower than 0.05 weight percentage, and more preferably not lowerthan 0.075 weight percentage.

The ratio of C (the amount of C) in SiC to the whole composite sinteredbody and the ratio of Mg (the amount of Mg) in the Mg—Al composite oxidehaving a spinel-type crystal structure to the whole composite sinteredbody are obtained by analysis methods in conformity with “JIS R1616” and“JIS R1649”. The amount of C is a value obtained by subtracting theamount of free C from all the amount of C in the composite sinteredbody. The amount of free C is caused by impurity carbon in the rawmaterial and the pebbles used in the mixing, and in Experimental Example1, for example, the amount of free C is 0.03 weight percentage. Herein,the ratio of the amount of SiC to the whole composite sintered body canbe derived by using the amount of C and the atomic weight of carbon(12.01) and the molecular weight of SiC (40.1). In Experimental Example1, for example, since the amount of C is 2.48 weight percentage fromTable 2, the amount of SiC can be derived to be 8.3 weight percentage.In Experimental Example 4, since the amount of C is 2.97 weightpercentage, the amount of SiC can be derived to be 9.9 weightpercentage. This value is sometimes different from the amount of SiC inthe raw material composition ratio of Table 1. This is because thisvalue includes errors of the amount of impurities, the weighting, theanalysis of the powder raw material, and the like. Further, though theratio of the amount of SiC to the whole composite sintered body can bederived by analyzing the amount of C and the amount of SiC with respectto the whole composite sintered body, in the range of ExperimentalExamples of this time, in consideration of the possibility that Sitogether with the Mg—Al composite oxide forms a reaction phase by thereaction of part of SiC, it is preferable to derive the ratio by usingthe amount of C (when SiC responds, C is discharged to the outside ofthe system in sintering).

In Experimental Examples 1 to 13, the open porosity is not higher than0.1%, the closed porosity is not higher than 1.0%, and the four-pointbending strength is not lower than 450 MPa. Further, the relativedielectric constant at a frequency of 300 kHz is not lower than 12. Thevolume resistivity is not lower than 1.0×10¹⁵ Ω·cm, and the withstandvoltage is not lower than 25 kV/mm. In Experimental Examples 1 to 13,tan δ at a frequency of 40 Hz, 300 kHz, and 1 MHz is not higher than1.0×10⁻². In Experimental Examples 1 to 13, as to the particle diameterof SiC, D10 is not smaller than 0.3 μm, D50 is not smaller than 0.7 μm,and D90 is not smaller than 1.5 μm. The sintered particle diameter(average particle diameter) of Al₂O₃ is not smaller than 2 μm. The ratioof C in SiC (the amount of C) to the whole composite sintered body isnot lower than 1.0 weight percentage and not higher than 4.0 weightpercentage. The ratio of Mg in the Mg—Al composite oxide (the amount ofMg) to the whole composite sintered body is not lower than 0.01 weightpercentage and not higher than 1.0 weight percentage.

In Comparative Examples 1 to 3, the composite sintered body includes noMg—Al composite oxide having a spinel-type crystal structure. InComparative Example 1, the relative dielectric constant is lower than12. In Comparative Example 2, the closed porosity is larger than 1.0%.It is thought that an increase in the closed porosity in ComparativeExample 2 is caused by abnormal grain growth (i.e., excessiveenlargement of a particle, also referred to as coarsening of theparticle diameter) of Al₂O₃ due to no addition of MgO. The averageparticle diameter of Al₂O₃ in the sintered body in Comparative Example 2is 93.3 μm. In Comparative Example 3, the open porosity is larger than0.1%. It is thought that an increase in the open porosity in ComparativeExample 3 is caused by occurrence of the abnormal grain growth of Al₂O₃since the purity of the Al₂O₃ powder which is a raw material is low andthe Mg—Al composite oxide having a spinel-type crystal structure is notthereby substantially formed. The average particle diameter of Al₂O₃ inthe sintered body in Comparative Example 3 is 8.7 μm. In ComparativeExample 4, as to the particle diameter of SiC, D10 is smaller than 0.3μm, D50 is smaller than 0.7 μm, and D90 is smaller than 1.5 μm. It isthought that this is because the average particle diameter of SiC whichis a raw material is small, being 0.3 μm. Further, in ComparativeExample 4, the open porosity is larger than 0.1% and the closed porosityis larger than 1.0%. It is thought that increases in the open porosityand the closed porosity in Comparative Example 4 are caused by that theaverage particle diameter of SiC which is a raw material is small, being0.3 μm. In Comparative Example 4, tan δ at a frequency of 300 kHz and ata frequency of 1 MHz is higher than 1.0×10′. It is thought that anincrease in the tan δ is caused by that the SiC which is a raw materialincludes α-SiC. In Comparative Example 5, tan δ at a frequency of 40 Hzis not higher than 1.0×10⁻², but tan δ at a frequency of 300 kHz and ata frequency of 1 MHz is higher than 1.0×10⁻². It is thought that anincrease in the tan δ at a frequency of 300 kHz and at a frequency of 1MHz is caused by that the SiC which is a raw material is α-SiC.

Each of Experimental Examples 14 to 17 in Tables 7 and 8 shows arelation between the content percentage of α-SiC in SiC contained in theraw material and the relative dielectric constant and the tan δ in thecomposite sintered body. The composite sintered bodies of ExperimentalExamples 14 to 17 are manufactured by the same manufacturing method asthat in above-described Experimental Examples 1 to 13. In ExperimentalExamples 14 to 17, the above-described content percentage of α-SiC ischanged. The content percentage of α-SiC powder is obtained by dividingthe weight of the α-SiC powder in the SiC powder by the total weight ofthe SiC powder (i.e., the sum of the weight of the α-SiC powder and theweight of the β-SiC powder). The same applies to the content percentageof β-SiC. Further, the α-SiC powder and the β-SiC powder used inExperimental Examples 14 to 17 are the same as those in ComparativeExample 5 and Experimental Example 1, respectively.

TABLE 7 Raw Material Composition Content Content Percentage ofPercentage of α -SiC in β -SiC in Al₂O₃ SiC MgO SiC SiC wt % wt % wt % %% Experimental 93.3 6.6 0.1 5 95 Example 14 Experimental 93.3 6.6 0.1 1090 Example 15 Experimental 93.3 6.6 0.1 25 75 Example 16 Experimental93.3 6.6 0.1 50 50 Example 17

TABLE 8 Sintered Body Properties Relative Dielectric Constant tan δ tanδ tan δ @300 KHz @40 Hz @300 KHz @1 MHz Experimental 14.2 <1.0E−03 1.8E−03 2.2E−03 Example 14 Experimental 14.5 1.2E−03 3.2E−03 3.9E−03Example 15 Experimental 14.5 3.5E−03 7.1E−03 7.8E−03 Example 16Experimental 14.8 1.2E−02 1.4E−02 1.3E−02 Example 17

In Comparative Examples 14 to 17, the content percentage of α-SiC is 5%,10%, 25%, and 50%, respectively, and the content percentage of β-SiC is95%, 90%, 75%, and 50%, respectively. In Comparative Examples 14 to 16,the relative dielectric constant at a frequency of 300 kHz is not lowerthan 12, and the tan δ at a frequency of 40 Hz, 300 kHz, and 1 MHz isnot higher than 1.0×10⁻². In Comparative Example 17, the relativedielectric constant is not lower than 12, but the tan δ at a frequencyof 40 Hz, 300 kHz, and 1 MHz is higher than 1.0×10⁻². In ComparativeExamples 14 to 17, the tan δ at a frequency of 40 Hz, 300 kHz, and 1 MHzbecomes higher as the content percentage of β-SiC becomes lower. Interms of reducing the tan δ, it is preferable that the contentpercentage of β-SiC in SiC contained in the raw material should behigher than 50%.

Further, though not shown in Table 7 or 8, in Comparative Examples 14 to17, the open porosity is not higher than 0.1%, the closed porosity isnot higher than 1.0%, and the four-point bending strength is not lowerthan 450 MPa. Furthermore, the volume resistivity is not lower than1.0×10¹⁵ Ω·cm, and the withstand voltage is not lower than 25 kV/mm. Asto the particle diameter of SiC, D10 is not smaller than 0.3 μm, D50 isnot smaller than 0.7 μm, and D90 is not smaller than 1.5 μm. Thesintered particle diameter (average particle diameter) of Al₂O₃ is notsmaller than 2 μm. The ratio of C (the amount of C) in SiC to the wholecomposite sintered body is not lower than 1.0 weight percentage and nothigher than 4.0 weight percentage. The ratio of Mg (the amount of Mg) inthe Mg—Al composite oxide to the whole composite sintered body is notlower than 0.01 weight percentage and not higher than 1.0 weightpercentage. Further, in Experimental Examples 14 to 17, it is confirmedby the Rietveld method that the content percentage of α-SiC in SiCcontained in the composite sintered body is substantially equal to thecontent percentage of α-SiC in SiC contained in the raw material. TheRietveld method is performed in conformity with “JIS K 0131” (Generalrules for X-ray diffraction analysis).

FIG. 5 is a view showing an X-ray diffraction pattern obtained bymeasuring the composite sintered body powder in Experimental Example 2by an X-ray diffraction apparatus. In this measurement, the compositesintered body which is a material is crushed by using a mortar and acrystal phase is identified by the X-ray diffraction apparatus. Themeasurement conditions are CuKα, 40 kV, 40 mA, and 2θ=5-70°, and asealed-tube X-ray diffraction apparatus (D8-ADVANCE manufactured byBruker AXS) is used. The step width of the measurement is 0.02°.

In FIG. 5 (Experimental Example 2), as a constituent phase, three phasesof Al₂O₃, SiC, and MgAl₂O₄ (spinel) are detected. The peak whichcoincides with the spinel is detected as a very small peak.

FIG. 6 is a view enlarging a low-count portion of FIG. 5 in order toclarify the peak of MgAl₂O₄. In FIG. 6, the peak of MgAl₂O₄ on thehigh-angle side is buried among other peaks and it is difficult tospecify a clear peak position. In Experimental Example 2, the peakposition of MgAl₂O₄ is shifted, as compared with the general peakposition of MgAl₂O₄ shown on the lower side of FIG. 6. Therefore, in thecomposite sintered body of the present preferred embodiment, though Mgis contained as the of MgAl₂O₄-type crystal phase (i.e., the Mg—Alcomposite oxide having a spinel-type crystal structure), it is thoughtthat a change in the constituent element ratio or a solid solutionreaction, for example, occurs due to the coexistence of SiC.

Then, in the composite sintered body of the present preferredembodiment, a tissue containing Mg is described as a Mg—Al compositeoxide as described earlier. In the Mg—Al composite oxide, Si may becontained by solid solution. Further, in the composite sintered body ofthe present preferred embodiment, also considered is a case where thepeak of MgAl₂O₄ cannot be detected from the X-ray diffraction patterndue to deterioration of the crystallinity thereof or the like. In thiscase, the existence of the Mg—Al composite oxide can be found byelemental mapping using EDS (Energy Dispersive x-ray Spectroscopy) orEPMA (Electron Probe x-ray Micro Analyzer).

FIG. 7 shows images of EDS elemental mapping performed on the compositesintered body of Experimental Example 2 with a magnification of 1000times. As to the elements of Al, Si, Mg, and O, each element exists athigher density in a portion where the color is brighter (closer to whitein this figure). In a distribution chart of Al of FIG. 7, the grayground color portion is an existing position of Al₂O₃, and Al is notdetected at a black portion scattered in an island shape. As comparedwith respective distribution charts of Si and O, Si is detected and O isnot detected in the island-shaped portion. From this fact, it can beseen that the island-shaped portion corresponds to the SiC particles andSiC are dispersed granularly in the Al₂O₃.

Further, in the distribution chart of Mg of FIG. 7, an area surroundedby a solid-line circle or a broken-line circle is an area where Mgexists. On the other hand, in the respective distribution charts of Al,Si, and O, an area surrounded by a solid-line circle is an areaoverlapping the area surrounded by the solid-line circle in thedistribution chart of Mg. In the areas surrounded by the solid-linecircles, Al and O exist and Si hardly exists in the portion where Mgexists. Therefore, in this portion, the Mg—Al composite oxide exists.Similarly, also in the area surrounded by the broken-line circle in thedistribution chart of Mg, the Mg—Al composite oxide exists in theportion where Mg exists.

FIGS. 8 to 10 show images of EPMA elemental mapping performed on thecomposite sintered body of Experimental Example 2 with a magnificationof 3000 times. In FIG. 8, an area surrounded by a circle with referencesign 81 is an area where Al exists, and in FIG. 9, an area surrounded bya circle with reference sign 82 is an area where Mg exists. Further, inFIG. 10, an area surrounded by a circle with reference sign 83 is anarea where O (oxygen) Mg exists. Therefore, in an overlapping area ofthe areas 81, 82, and 83, the Mg—Al composite oxide exists.

Furthermore, the EPMA elemental mapping image is colored in accordancewith the density into red, orange, yellow, yellow-green, green, blue, orindigo, and red represents the highest density and indigo represents thelowest density, and black represents zero. Since FIGS. 8 to 10 are shownin monochrome, however, original colors in FIGS. 8 to 10 will bedescribed below. In FIG. 8 showing the Al area, the ground color isyellow and the island-shaped portion is colored in green to blue. InFIG. 9 showing the Mg area, the ground color is indigo and thepoint-like portion is colored in blue. In FIG. 10 showing the O area,the ground color is orange and the island-shaped portion is colored ingreen to blue.

As described above, the above-described composite sintered body includesAl₂O₃, SiC, and the Mg—Al composite oxide having a spinel-type crystalstructure. The SiC includes β-SiC. As to the particle diameter of SiC inthe composite sintered body, D50 is not smaller than 0.7 μm. The ratioof C in SiC to the composite sintered body is not lower than 1.0 weightpercentage and not higher than 4.0 weight percentage. The Mg—Alcomposite oxide having a spinel-type crystal structure is therebydispersedly arranged in a grain boundary of Al₂O₃ with high uniformity,and as a result, it is possible to suppress the abnormal grain growth ofAl₂O₃. Further, it is possible to provide a composite sintered bodyhaving high relative dielectric constant and withstand voltage, and lowtan δ.

Specifically, the relative dielectric constant at a frequency of 40 Hzand at a frequency of 1 MHz is preferably not lower than 12. It isthereby possible to increase the insulation of the composite sinteredbody. Further, in the case where the composite sintered body is used forthe electrostatic chuck 1, it is possible to increase the adsorptionforce for the substrate 9. The relative dielectric constant is morepreferably not lower than 13, and further preferably not lower than 14.Furthermore, more preferably, the relative dielectric constant in arange of frequency not lower than 40 Hz and not higher than 1 MHz is notlower than 12 (further preferably not lower than 13, and still morepreferably not lower than 14).

Further, the withstand voltage of the composite sintered body ispreferably not lower than 25 kV/mm. It is thereby possible to suitablyprevent or suppress the dielectric breakdown of the composite sinteredbody. The withstand voltage is more preferably not lower than 30 kV/mm,and further preferably not lower than 50 kV/mm.

The tan δ of the composite sintered body at a frequency of 40 Hz and ata frequency of 1 MHz is preferably not higher than 1.0×10⁻². It isthereby possible to suitably suppress the dielectric loss of thecomposite sintered body in the application of an alternating current andsuppress an increase in the temperature of the composite sintered body.The tan δ is more preferably not higher than 5.0×10⁻³, and furtherpreferably not higher than 3.0×10⁻³. Further, more preferably, the tan δin a range of frequency not lower than 40 Hz and not higher than 1 MHzis not higher than 1.0×10⁻² (further preferably not higher than5.0×10⁻³, and still more preferably not higher than 3.0×10⁻³).Furthermore, the value of tan δ tends to depend on the frequency, andthe value of tan δ tends to become lower as the measurement frequencybecomes lower even in the measurement using the same sample.

The volume resistivity of the composite sintered body at a temperatureof 25° C. is preferably not lower than 1.0×10¹⁵ Ω·cm. It is therebypossible to prevent or suppress leakage of a current through thecomposite sintered body. The volume resistivity is more preferably notlower than 5.0×10¹⁵ Ω·cm, and further preferably not lower than 1.0×10¹⁶Ω·cm.

The closed porosity of the composite sintered body is preferably nothigher than 1.0%. It is thereby possible to prevent or suppress theleakage of a current through the composite sintered body. The closedporosity is more preferably not higher than 0.7%, and further preferablynot higher than 0.5%.

The four-point bending strength of the composite sintered body ispreferably not lower than 450 MPa. It is thereby possible to suitablyprevent or suppress breakage of the composite sintered body. Thefour-point bending strength is more preferably not lower than 470 MPa,and further preferably not lower than 490 MPa.

In the composite sintered body, as to the particle diameter of SiC,preferably, D10 is not smaller than 0.3 μm. Further, it is preferablethat D90 should not be smaller than 1.5 μm. Thus, since the particlediameter of SiC in the composite sintered body is relatively large, itis possible to suppress fall-off due to corrosion of SiC. As a result,it is possible to suppress coarsening of the surface of the compositesintered body. Furthermore, since the SiC particles can be suppressed tobecome a conductive path, it is possible to increase the withstandvoltage.

As described above, in the composite sintered body, it is preferablethat the content percentage of β-SiC in SiC should be larger than 50%.It is thereby possible to further reduce the tan δ of the compositesintered body. More preferably, the content percentage of β-SiC in SiCis substantially 100%. In other words, the crystal type of SiC is βtype. It is thereby possible to further reduce the tan δ of thecomposite sintered body.

As to the sintered particle diameter of Al₂O₃ after Step S12, theaverage particle diameter is not smaller than 2 μm. Thus, since theparticle diameter of Al₂O₃ in the composite sintered body is relativelylarge, it is possible to suppress desorption of Al₂O₃ particles from thecomposite sintered body and suppress generation of undesired particles.

In the composite sintered body, by including the Mg—Al composite oxidehaving a spinel-type crystal structure, it is possible to prevent orsuppress an increase in the sintering temperature and the abnormal graingrowth of Al₂O₃ due to the inclusion of SiC. As a result, it is possibleto increase the denseness of the composite sintered body and theuniformity of the particle diameter distribution and increase the yieldin the manufacture of the composite sintered body. As an index of thedenseness, it is preferable that the open porosity of the compositesintered body should be not higher than 0.1%. Further, in the compositesintered body, by keeping the ratio of Mg in the Mg—Al composite oxideto the composite sintered body not lower than 0.015 weight percentageand not higher than 0.5 weight percentage, it is possible to furthersuitably prevent or suppress the abnormal grain growth of the Al₂O₃.

As described above, since the composite sintered body has high relativedielectric constant and withstand voltage and low tan δ, the compositesintered body is suitable for the semiconductor manufacturing apparatusmember to be used in the semiconductor manufacturing apparatus. Thecomposite sintered body is especially suitable for a semiconductormanufacturing apparatus member to be used in a high-power semiconductormanufacturing apparatus such as a high-power etching apparatus or thelike. As a preferable example of the semiconductor manufacturingapparatus member formed by using the composite sintered body, theabove-described electrostatic chuck 1 may be adopted. As describedabove, the electrostatic chuck 1 includes the chuck body 23 formed byusing a composite sintered body and the internal electrode 24 disposedinside the chuck body 23.

The electrostatic chuck 1 can hold the substrate 9 by suitableadsorption in the semiconductor manufacturing apparatus. Further, asdescribed above, since the respective particle diameters of Al₂O₃ andSiC are relatively large, it is possible to prevent or suppress fall-offdue to corrosion of SiC. As a result, it is possible to suppresscoarsening of the surface of the chuck body 23. Furthermore, it ispossible to suppress desorption of the Al₂O₃ particles from the chuckbody 23 at the adsorption of the substrate 9 or the like and suppressgeneration of undesired particles.

As described above, the method of manufacturing a composite sinteredbody includes a step (Step S11) of molding mixed powder in which Al₂O₃,SiC, and MgO are mixed, into a green body having a predetermined shapeand a step (Step S12) of generating a composite sintered body bysintering the green body. Then, the SiC includes β-SiC. In Step S11, theratio of SiC to the mixed powder is not lower than 4.0 weight percentageand not higher than 13.0 weight percentage. Further, the purity of Al₂O₃in Step S11 is not lower than 99.9%. The Mg—Al composite oxide having aspinel-type crystal structure is thereby dispersedly arranged in a grainboundary of Al₂O₃ with high uniformity, and as a result, it is possibleto suppress the abnormal grain growth of Al₂O₃. Further, it is possibleto suitably manufacture a composite sintered body having high relativedielectric constant and withstand voltage, and low tan δ.

Furthermore, in Step S11, the ratio of MgO to the mixed powder is notlower than 0.05 weight percentage and not higher than 1.0 weightpercentage. It is thereby possible to suitably prevent or suppress anincrease in the sintering temperature and the abnormal grain growth ofAl₂O₃ due to the inclusion of SiC.

As described above, as to the particle diameter (i.e., the raw materialparticle diameter) of SiC in Step S11, D10 is not smaller than 0.3 μm,D50 is not smaller than 1 μm, and D90 is not smaller than 2 μm. It isthereby possible to suitably manufacture the above-described compositesintered body in which the particle diameter of SiC is relatively large.

<Variations>

In the composite sintered body, the semiconductor manufacturingapparatus member, and the method of manufacturing the composite sinteredbody which are described above, various modifications can be made.

In the composite sintered body, for example, the ratio of Mg in theMg—Al composite oxide to the composite sintered body may be lower than0.01 weight percentage or may be higher than 1.0 weight percentage.Further, the open porosity of the composite sintered body may be higherthan 0.1%, and the closed porosity may be higher than 1.0%. Thewithstand voltage of the composite sintered body may be lower than 25kV/mm. The tan δ of the composite sintered body in a range of frequencynot lower than 40 Hz and not higher than 1 MHz may be higher than1.0×10⁻². The relative dielectric constant of the composite sinteredbody in a range of frequency not lower than 40 Hz and not higher than 1MHz may be lower than 12. The volume resistivity of the compositesintered body at a temperature of 25° C. may be lower than 1.0×10¹⁵Ω·cm. The four-point bending strength of the composite sintered body maybe lower than 450 MPa.

In the composite sintered body, as the particle diameter of the SiCparticles dispersed in Al₂O₃, D10 may be smaller than 0.3 μm, and D90may be smaller than 1.5 μm. As to the sintered particle diameter ofAl₂O₃, the average particle diameter may be smaller than 2 μm.

In the manufacture of the composite sintered body, the ratio of MgO tothe mixed powder in Step S11 may be lower than 0.025 weight percentageor may be higher than 1.0 weight percentage. As to the particle diameterof SiC (i.e., the raw material particle diameter) in Step S11, D10 maybe smaller than 0.3 μm. Further, D50 may be smaller than 1 μm, or D90may be smaller than 2 μm.

The maximum sintering temperature in Step S12 may be lower than 1650°C., or may be higher than 1725° C. In Step S12, the composite sinteredbody may be generated by any one of various sintering methods other thanthe hot-press method.

The composite sintered body may be used for manufacturing varioussemiconductor manufacturing apparatus members other than theelectrostatic chuck 1. For example, the composite sintered body may beused for manufacturing a susceptor to be used to apply high frequency tothe substrate 9. Further, a member to be used in an apparatus other thanthe semiconductor manufacturing apparatus may be formed by using thecomposite sintered body. For example, the composite sintered body may beused for manufacturing a ceramic heater for heating an object.

The configurations in the above-discussed preferred embodiment andvariations may be combined as appropriate only if those do not conflictwith one another.

INDUSTRIAL APPLICABILITY

The present invention can be used for a field relating to asemiconductor manufacturing apparatus, for example, for manufacturing anelectrostatic chuck which holds a semiconductor substrate by adsorptionusing the Coulomb force or the Johnsen-Rahbek force.

REFERENCE SIGNS LIST

1 Electrostatic chuck

9 Semiconductor substrate

23 Chuck body

24 Internal electrode

S11 to S12 Step

1. A composite sintered body, comprising: aluminum oxide; siliconcarbide; and magnesium-aluminum composite oxide having a spinel-typecrystal structure, wherein said silicon carbide includes β-type siliconcarbide, as to the particle diameter of said silicon carbide, D50 is notsmaller than 0.7 μm, and the ratio of carbon in said silicon carbide tosaid composite sintered body is not lower than 1.0 weight percentage andnot higher than 4.0 weight percentage.
 2. The composite sintered bodyaccording to claim 1, wherein the ratio of magnesium in saidmagnesium-aluminum composite oxide to said composite sintered body isnot lower than 0.01 weight percentage and not higher than 1.0 weightpercentage.
 3. The composite sintered body according to claim 1, whereinthe closed porosity thereof is not higher than 1.0%.
 4. The compositesintered body according to claim 1, wherein as to the particle diameterof said silicon carbide, D10 is not smaller than 0.3 μm.
 5. Thecomposite sintered body according to claim 1, wherein as to the particlediameter of said silicon carbide, D90 is not smaller than 1.5 μm.
 6. Thecomposite sintered body according to claim 1, wherein the percentage ofβ-type silicon carbide contained in said silicon carbide is higher than50%.
 7. The composite sintered body according to claim 1, wherein as tothe sintered particle diameter of said aluminum oxide, the averageparticle diameter is not smaller than 2 μm.
 8. The composite sinteredbody according to claim 1, wherein the withstand voltage thereof is notlower than 25 kV/mm.
 9. The composite sintered body according to claim1, wherein the dielectric loss tangent thereof at a frequency of 40 Hzand at a frequency of 1 MHz is not higher than 1.0×10⁻².
 10. Thecomposite sintered body according to claim 1, wherein the relativedielectric constant thereof at a frequency of 40 Hz and at a frequencyof 1 MHz is not lower than
 12. 11. The composite sintered body accordingto claim 1, wherein the volume resistivity thereof at a temperature of25° C. is not lower than 1.0×10¹⁵ Ω·cm.
 12. The composite sintered bodyaccording to claim 1, wherein the four-point bending strength thereof isnot lower than 450 MPa.
 13. The composite sintered body according toclaim 1, wherein the open porosity thereof is not higher than 0.1%. 14.A semiconductor manufacturing apparatus member used in a semiconductormanufacturing apparatus, being formed by using said composite sinteredbody according to claim
 1. 15. The semiconductor manufacturing apparatusmember according to claim 14, being an electrostatic chuck comprising: achuck body produced by using said composite sintered body; and aninternal electrode arranged inside said chuck body.
 16. A method ofmanufacturing a composite sintered body, comprising: a) molding mixedpowder in which aluminum oxide, silicon carbide, and magnesium oxide aremixed, into a green body having a predetermined shape; and b) generatinga composite sintered body by sintering said green body, wherein saidsilicon carbide includes β-type silicon carbide, the ratio of saidsilicon carbide in said mixed powder is not lower than 4.0 weightpercentage and not higher than 13.0 weight percentage in said operationa), and the purity of said aluminum oxide in said operation a) is notlower than 99.9%.
 17. The method of manufacturing a composite sinteredbody according to claim 16, wherein the ratio of said magnesium oxide insaid mixed powder is not lower than 0.05 weight percentage and nothigher than 1.0 weight percentage in said operation a).
 18. The methodof manufacturing a composite sintered body according to claim 16,wherein as to the raw material particle diameter of said silicon carbidein said operation a), D10 is not smaller than 0.3 μm, D50 is not smallerthan 1 μm, and D90 is not smaller than 2 μm.
 19. The method ofmanufacturing a composite sintered body according to claim 16, whereinas to the sintered particle diameter of said aluminum oxide after saidoperation b), the average particle diameter is not smaller than 2 μm.